Copper Physical Properties
| Description | Measurement | |
| Density at 20 ° C | 8.94g/cm³ | |
| Melting point | 1083°C | |
| Coefficient of thermal expansion at: | ||
| 25-100°C | 0.000 016 8 per°C | |
| 25-300°C | 0.000 017 7 per°C | |
| Thermal conductivity at: | ||
| 20°C | 395 W/Km 0.94 cal, cm/cm2s°C |
|
| Electrical conductivity at: | ||
| 20°C soft annealed | 58.00-58.9 m/ohm mm² | |
| 20°C fully cold worked | 58.3-56.6 m/ohm mm² | |
| Electrical resistivity at: | ||
| 20°C soft annealed | Max 17.241 nΩm | |
| 20°C fully cold worked | 17.86-17.65 nΩm | |
| Temperature coefficient of electrical resistance at: | ||
| 20°C soft annealed | 0.003 93 per °C 100% IACS |
|
| 20°C fully cold worked | 0.003 81 per °C 97% IACS |
|
| Modulus of elasticity (tension) at: | ||
| 20°C annealed | 118kN/mm² | |
| Modulus of rigidity at: | ||
| 20°C annealed | 44kN/mm² |
| Material: OF-OK™ | ||||
| OK-type | USA UNS (CDA)- number |
UK BS |
Germany DIN |
|
| OF-OK™ | C 10200 OF ASTM B170-82 - grade 2 |
6071 1981 Cu-OF |
1787 OF-Cu |
